Hostname: page-component-745bb68f8f-lrblm Total loading time: 0 Render date: 2025-02-05T14:42:36.877Z Has data issue: false hasContentIssue false
  • English
  • Français

X-Ray Stress Studies of Passivated and Unpassivated Narrow Aluminum Metallizations

Published online by Cambridge University Press:  16 February 2011

C. A. Paszkiet ,
M. A. Korhonen  and
Che-Yu Li
C. A. Paszkiet
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, New York 14853
M. A. Korhonen
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, New York 14853
Che-Yu Li
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, New York 14853
Get access

Abstract

Stresses in thin narrow textured metal lines were measured using x-ray diffraction techniques. Arrays of 1.5μm wide, 0.32μm thick aluminum lines, both with and without a 0.32μm thick SiNx passivation layer, were heat-treated at 400°C in a hydrogen/nitrogen atmosphere. After heat treatment the lines were examined periodically using chromium radiation to monitor the relaxation of the stress developed during heat treatment. The apparent stress in both the passivated and unpassivated lines relaxed significantly over the measurement period of three days. The higher stresses present in the passivated lines may be partially responsible for the voids which were found after aging at room temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 188: Symposium K – Thin Films: Stresses and Mechanical Properties II , 1990 , 153
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Klema, J., Pyle, R., Domangue, E., Proc. 1984 IEEE IRPS, 1–5.Google Scholar
2. Curry, J., Fitzgibbon, G., Guam, Y., Mollo, R., Nelson, G. and Thomas, A., Proc. 1984 IEEE IRPS, 6–8.Google Scholar
3. Black, J. R., IEEE Transactions on Electron Devices, Vol. Ed–16, No. 4, April 1969.Google Scholar
4. Flinn, Paul A., Gardener, Donald S. and Nix, William D., IEEE Transactions on Electron Devices, Vol. ED–34, No. 3 (March 1987), 689–699.Google Scholar
5. Vreeland, T. Jr., Dommann, A., Tsai, C. -J. and Nicolet, M. A., Mat. Res. Soc. Symp. Proc. Vol.130 (1989), 3–12.Google Scholar
6. Doerner, M. F. and Brennan, S., J. Appi. Phys. 63 (1), 1988, 126–131.Google Scholar
7. Shute, C. J., Cohen, J. B. and Jeannotte, D. A., “Residual Stress Analysis of A1 alloy Thin Films by X-Ray Diffraction as a Function of Film Thickness,” Proc. of MRS Conference, Boston MA, Nov 28- Dec 3, 1988.Google Scholar
8. Korhonen, H. A. and Paszkiet, Christine A., Scripta Met., Vol.23 (1989), 1149–1454.Google Scholar
9. Cullity, B. D., Elements of X-Ray Diffraction, Addison-Wesley, Reading, MA., 1978, 75.Google Scholar
10. Hilliard, John E., Metal Progress, Vol 85, May 1964, 99–102.Google Scholar
11. Paszkiet, C. A., unpublished data.Google Scholar
12. Doerner, M. F. and Nix, W. D., “Stresses and Deformation Processes in Thin Films on Substrates,” in CRC Critical Reviews in Solid State and Materials Science, Vol.14, No. 3 (1988), 224–268.Google Scholar
13. Flinn, P. A. and Chiang, C., J. Appl. Phys. 67 (6), 15 March 1990, 2927.Google Scholar
14. Korhonen, M. A., Paszkiet, C. A., Black, R. D. and Li, Che-Yu, submitted to Scripta Metallurgica.Google Scholar
15. Hinode, K., Owada, N., Nishida, T. and Mukai, K., J. Vac. Sci. Technol. B, 5 (1987), 518.Google Scholar
16. Timoshenko, S., “Strength of Materials,” (1958), 228.Google Scholar
17. Eshelby, J.D., Proc. Roy. Soc. A 241, London, (1957) 378.Google Scholar
18. Doerner, M. F., Gardner, D. S. and Nix, W. D., J. Mater. Res. 1(6), Nov/Dec 1986, 845–851.Google Scholar
19. Stone, D., LaFontaine, W. R., Alexopoulos, P.. Wu, T. -W. and Li, Che-Yu, J. Mater. Res. 3 (1), Jan/Feb 1988, 141–147.Google Scholar