Hostname: page-component-745bb68f8f-b95js Total loading time: 0 Render date: 2025-02-04T16:45:49.288Z Has data issue: false hasContentIssue false
  • English
  • Français

Wireless and RF Module Packaging using Low Loss Ceramic and Low Loss Organic Materials

Published online by Cambridge University Press:  01 February 2011

James J. Logothetis ,
Daniel I. Amey  and
Timothy P. Mobley
James J. Logothetis
Affiliation:
Merrimac Industries Inc., West Caldwell, NJ
Daniel I. Amey
Affiliation:
Merrimac Industries Inc., West Caldwell, NJ
Timothy P. Mobley
Affiliation:
DuPont Microcircuit Materials Research, Triangle Park, NC
Get access

Abstract

This presentation describes the basics of Multi-Mix® and Green Tape™ Low Temperature Cofired Ceramic (LTCC) technologies. The design and performance of a 28 GHz mixer package using a GaAs MMIC and the 943 Green Tape™ LTCC system with embedded capacitance technology is described including the tradeoffs, advantages and compatibility of Multi-Mix® and Green Tape™ technologies. A design approach combining the technologies offers the designer new options to meet the ever-increasing demands of high frequency packaging.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 783: Symposium B – Materials, Intergration, and Packaging Issues for High-Frequency Devices , 2003 , B1.4
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Felten, J. J. “Advanced Embedded Passives Technologies - Putting Ceramic Components into Organic PWB's” ECWC9 Paper IPC31, October 2002, Cologne Germany Google Scholar
[2] Needes, C.R.S., Amey, D.I. and Horowitz, S.J. “Cost Effective Solutions for High Density Interconnect and RF Modules Using Low Temperature Cofired Ceramic Materials” IMC/IEMT Conference, April 2000 Google Scholar
[3] Donohue, P.C et.al., “A new Low Loss Lead Free LTCC System for Wireless and RF Applications”, Proceedings of the 1998 International Conference on Multichip Modules and High Density Packaging, pp 196–199, 1998 Google Scholar
[4] Amey, D.I., Keating, M.Y., Smith, M.A., Horowitz, S.J., Donahue, P.C. and Needes, C.R.S. “Low Loss Tape Material System for 10 to 40 GHz Application” 2000 Proceedings of the International Symposium on Microelectronics, pp 654–658 Google Scholar
[5] Hittite Microwave Corporation, HMC264 Product Specification sheetGoogle Scholar
[6] Schaper, L.W., Amey, D.I., “Improved Electrical Performance Required for Future MOS Packaging”, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. CHMT–6, No. 3, September 1983 Google Scholar