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Vapor Phase Cleaning of Silicon Wafers

Published online by Cambridge University Press:  25 February 2011

Bruce E. Deal  and
C. Robert Helms
Bruce E. Deal
Affiliation:
Stanford University, Electrical Engineering Department, Stanford, CA 94305
C. Robert Helms
Affiliation:
Stanford University, Electrical Engineering Department, Stanford, CA 94305
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Abstract

Vapor phase cleaning of silicon wafers is reviewed. Particular emphasis is placed on oxide etching and removal, including the mechanisms involved in vapor HF etching of silicon oxides. Other items discussed include native oxide formation, impurity removal, and device applications. Future directions involving other chemistries and integrated processing are summarized.

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References

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