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Under Bump Metallization Development for Eutectic Pb-Sn Solders

Published online by Cambridge University Press:  10 February 2011

S. J. Hong ,
T. M. Korhonen ,
M. A. Korhonen  and
C.-Y. LI
S. J. Hong
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14850
T. M. Korhonen
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14850
M. A. Korhonen
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14850
C.-Y. LI
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14850
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Abstract

Due to its advantage in number of I/Os over other interconnection method, flip chip interconnection technology plays a key role in today's electronics packaging. Good understanding of interfacial reactions between the solder balls and under bump metallizations (UBM) is crucial in producing sound and reliable solder joints. In the present paper, several new under bump metallization (UBM) schemes using Ni or CuNi alloys as solderable layer are investigated. Cr or Ti is used as the adhesion layer. Test joint are made by reflowing eutectic Pb-Sn solder balls on UBMs and through the use of scanning electron microscopy (SEM) and micromechanical shear testing, the reliability of the UBM scheme is determined. Experimental result shows that some of the new schemes, featuring CuNi wettable layer with Cr or Ti adhesion layer produce reliable joints.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 73
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

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