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Transgranular Slits in Aluminum Interconnects Caused by Thermal Stress and Electric Current

Published online by Cambridge University Press:  22 February 2011

W. Wang ,
Z. Suo  and
T.-H. Hao
W. Wang
Affiliation:
Mechanical Engineering Department, University of California, Santa Barbara, CA 93106
Z. Suo
Affiliation:
Mechanical Engineering Department, University of California, Santa Barbara, CA 93106
T.-H. Hao
Affiliation:
On leave from China Textile University, Shanghai 200051, P.R., China
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Abstract

An aluminum interconnect can fail by a transgranular slit. We show how a rounded void collapses to such a slit, as atoms diffuse on the void surface, driven by electric current, thermal stress, and surface energy. We use a variational principle to simulate the shape evolution, and identify the critical conditions to trigger the shape instability.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 338: Symposium – Materials Reliability in Microelectronics IV , 1994 , 415
Copyright
Copyright © Materials Research Society 1994

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References

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