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Thermal and Mechanical Analysis of a Multichip Module

Published online by Cambridge University Press:  15 February 2011

M. S. Hu
M. S. Hu*
Affiliation:
Diceon Electronics Inc., Advanced Development Center, Chatsworth, CA 91311
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Abstract

High speed, high density packaging requirements have made multichip modules (MCM) one of the most active areas of research in the electronic industry.

High density printed wiring board (PWB) have low production cost and good electrical performance. However, the most questioned issue in application is the reliability. As a result, a thermal and mechanical analysis on a MCM has been conducted to understand its feasibility. The results indicate that with proper design, the components can operate under satisfactory conditions on PWB laminates.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 219
Copyright
Copyright © Materials Research Society 1992

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