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Texture Formation and Improvement of Grain Boundary Weak‐Links in Tape Shaped Wire Prepared by the Unidirectional Solidification Technique.

Published online by Cambridge University Press:  28 February 2011

Michiya Okada ,
Toyotaka Yuasa ,
Tosimi Matsumoto ,
Katuzo Aihara ,
Masahiro Seido  and
Sinpei Matsuda.
Michiya Okada
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Toyotaka Yuasa
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Tosimi Matsumoto
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Katuzo Aihara
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Masahiro Seido
Affiliation:
Metal Research Laboratory, Hitachi Cable Ltd., Tsuchiura, Ibaraki 300.
Sinpei Matsuda.
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
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Abstract

Au‐Sheathed Y‐Ba‐Cu‐O(YBCO) and Tl‐Ba/Sr‐Ca‐Cu‐O(TBSCCO) tapes were fabricated by the drawing‐rolling and subsequent unidirectional solidification. A typical microstructure of melt‐textured polycrystallite including fine particles of second phase(e.q. Y‐211) was observed. The Tl‐2223 tapes prepared at an optimized condition yielded Jc=15,300 A/cm2 at 77K in the absence of magnetic field, and l,100A/cm2 in a magnetic field of IT. The enhancement of Jc in a magnetic field is suggested to be due to the improvement of weak‐links in grain boundaries.

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References

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