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Texture Effects on the Electromigration Behavior of Layered Ti/AlCu/Ti Films

Published online by Cambridge University Press:  15 February 2011

K. P. Rodbell ,
D. B. Knorr  and
D. P. Tracy
K. P. Rodbell
Affiliation:
IBM Research Division, Yorktown Heights, NY 10598
D. B. Knorr
Affiliation:
Materials Engineering Department, Rensselaer Polytechnic Institute, Troy, NY 12180–3590.
D. P. Tracy
Affiliation:
Materials Engineering Department, Rensselaer Polytechnic Institute, Troy, NY 12180–3590.
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Abstract

A strong correlation was found between film texture, quantified as fiber plots of (111) intensity versus tilt angle from the normal direction, and the resulting electromigration behavior of layered Ti/AlCu/Ti films. Superior electromigration behavior was found for those films which had a low volume fraction of randomly oriented grains, strong and sharp texture. Film microstructure and electromigration lifetime data on DC magnetron sputtered and electron gun evaporated AI-Cu and layered fine lines, fabricated and tested in the same laboratory, are included for a direct comparison. Outstanding electromigration lifetimes were measured for sputtered, layered, submicron films with copper concentrations between 0.12 - 2wt.%Cu. In contrast the electromigration lifetimes of evaporated layered films were found to degrade rapidly at < 2wt.%Cu. This anomalous electromigration behavior was attributed to both film texture and subtle structural differences in the Ti-Al intermetallics formed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 265: Symposium H – Materials Reliability in Microelectronics II , 1992 , 107
Copyright
Copyright © Materials Research Society 1992

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References

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