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Texture Analysis of Al and Cu Metallization Materials Using Orientation Imaging Microscopy

Published online by Cambridge University Press:  10 February 2011

D. T. Carpenter ,
R. Alvis  and
G. Morales
D. T. Carpenter
Affiliation:
Department of MS&E, Lehigh University, Bethlehem, PA 18015
R. Alvis
Affiliation:
Advanced Micro Devices, Sunnyvale, CA 94088
G. Morales
Affiliation:
Advanced Micro Devices, Sunnyvale, CA 94088
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Abstract

X-ray diffraction (XRD) is generally used to measure crystallographic texture, but complete analysis is rarely performed. Orientation imaging microscopy (OIM) gives similar data by electron diffraction and has potential for widespread use since it may be added to any scanning electron microscope. Analysis software has been developed to reduce QIM results into a form which may be compared directly to XRD results. OIM texture parameters measured from Al films showed good quantitative agreement with XRD parameters, however the texture in Cu films is more complex and difficult to compare. Although subject to certain limitations, OIM has several advantages over XRD including more efficient data collection, better sensitivity to minor texture components, and more flexible data analysis.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 523: Symposium U – Electron Microscopy of Semiconducting Materials & ULSI Devices , 1998 , 79
Copyright
Copyright © Materials Research Society 1998

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