Published online by Cambridge University Press: 25 February 2011
Using Remote PECVD we have deposited layers of “device quality” a-Si:H and Si-based dielectrics. We find that the formation of depletion or accumulation layers at a-Si:H/dielectric interface depends on the specific dielectric (SiO2 or Si3N4) and on the film deposition sequence. In addition, we have studied process-gas/substrate interactions by in-situ Auger Electron Spectroscopy (AES) and determined that Si-O or Si-N bonds are produced at a-Si and c-Si surfaces exposed to plasma excited He/O2, or NH3 mixtures, respectively. These process-gas/substrate interactions occur in parallel with film deposition and are correlated with the electronic properties of the interfaces, and the layer deposition sequence.