Hostname: page-component-745bb68f8f-cphqk Total loading time: 0 Render date: 2025-01-28T23:54:20.380Z Has data issue: false hasContentIssue false
  • English
  • Français

Study of Crack Propagation at an Oxide/Polymer Interface Under Varying Loading Conditions

Published online by Cambridge University Press:  10 February 2011

Dtmitrios Panteliidis ,
Jeffrey Snodgrass ,
Reinhold H. Dauskardt  and
John C. Bravman
Dtmitrios Panteliidis
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
Jeffrey Snodgrass
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
Reinhold H. Dauskardt
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
John C. Bravman
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
Get access

Abstract

We investigate the effect of loading conditions and process parameters on the failure mode of a Silicon/SiO2/Silane/BCB interface system. Chemical analysis of the fracture surfaces with XPS reveals different crack paths through the structure for the two different loading configurations studied. Furthermore, the curing temperature of the silane coupling agent is shown to have a profound impact on the subcritical debond behavior of the structure. A mechanism responsible for this effect is identified and the XPS data is directly correlated to quantitative information about the resistance of the structure to fracture and subcritical crack growth.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 594: Symposium V – Thin Films - Stresses & Mechanical Properties VIII , 1999 , 407
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. ”MicroelectronicsP ackagingH andbook,” ed. by Tummala, R. R., Rymaszewski, E. J., and Klopfenstein, A. G., Chapman & Hall, c1997, v. II, pp.509–613.Google Scholar
2. Strandjord, A. J. G., “Photosensitive Benzocyclobutene for Stress-Buffer and Passivation Applications,” Proceedings of 47th Electronic Components and Technology Conference, (1997) p. 1260–8.Google Scholar
3. Plueddemann, E. P., ”Silane Coupling Agents,” 2nd ed. (New York: Plenum Press, c 1991)Google Scholar
4. Pantelidis, Dimitrios, Lee, Hoo-Jeong and Bravman, John C., “Effect of Microstructure and Chemical Bonding on the Adhesion Strength of a Silicon/Polymer Interface for Microelectronic Packaging Applications”. Integration of Dissimilar Materials in Micro- and Optoelectronics. Symposium. Held: Boston, MA, USA 30 Nov-1 Dec. 1998, in print.Google Scholar
5. Kook, S.-Y., Snodgrass, J. M., Kirtikar, A., and Dauskardt, R.H., “Adhesion and Reliability of Polymer/Inorganic Interfaces,” Journal of Electronic Packaging, vol. 120, no.4, p. 328–35.Google Scholar