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Slip Free Rapid Thermal Processing

Published online by Cambridge University Press:  28 February 2011

Julian Blake ,
Jeffrey C. Gelpey ,
John F. Moquin ,
James Schlueter  and
Ron Capodilupo
Julian Blake
Affiliation:
Eaton Thin Film Systems, 35 Cherry Hill Drive, Danvers, Massachusetts 01923
Jeffrey C. Gelpey
Affiliation:
Eaton Thin Film Systems, 35 Cherry Hill Drive, Danvers, Massachusetts 01923
John F. Moquin
Affiliation:
Eaton Thin Film Systems, 35 Cherry Hill Drive, Danvers, Massachusetts 01923
James Schlueter
Affiliation:
Eaton Thin Film Systems, 35 Cherry Hill Drive, Danvers, Massachusetts 01923
Ron Capodilupo
Affiliation:
Eaton Thin Film Systems, 35 Cherry Hill Drive, Danvers, Massachusetts 01923
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Abstract

Slip is a primary concern in Rapid Thermal Processing (RTP). Diagnostics for slip are compared, including: visual inspection, differential interference contrast microscopy (Nomarski), X-ray topography, decorative etching and optical surface scanning. Data from each technique are presented. RTP control parameters (temperature uniformity, heat up and cool down rates, edge cooling) and substrate parameters (wafer size, oxygen content, edge damage) which may have an effect on slip are discussed. Typical results for implant annealing sequences on a water-wall DC arc lamp RTP system are presented and used to suggest techniques for process optimization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 92: Symposium B – Rapid Thermal Processing of Electronic Materials , 1987 , 265
Copyright
Copyright © Materials Research Society 1987

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References

REFERENCES

1. Leroy, B. and Plougonovan, C., J. Electrochemical Society 127 [4], 961–970 (1980).Google Scholar
2. Widmer, A. E. and Rehwald, W., J. Electrochemical Society 133 [11], 2403–2409 (1986).Google Scholar
3. Gelpey, J. C. et al. , “Uniformity Characterization of an RTP system” Nuclear Instrumentation and Methods B (to be published).Google Scholar
4. Sedgwick, T., Michel, A., Cohen, S., Deline, V. and Oehrlein, G., Appl. Phys. Lett. 47, 848 (1985).Google Scholar
5. Rozgonyi, G. A. and Miller, D. C., Thin Solid Films 31, 185–216 (1976).Google Scholar