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Simple Computer Modeling of the Grain Microstructure of Al-4wt%Cu Interconnection Lines

Published online by Cambridge University Press:  10 February 2011

K.S. Low ,
S.J. Bull  and
A.G. O'Neill
K.S. Low
Affiliation:
Department of Electrical and Electronic Engineering
S.J. Bull
Affiliation:
Department of Mechanical, Materials and Manufacturing Engineering, University of Newcastle upon Tyne, Newcastle upon Tyne, NEI 7RU, U.K.
A.G. O'Neill
Affiliation:
Department of Electrical and Electronic Engineering
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Abstract

A simple computer model is proposed to simulate the microstructural evolution of Al-4wt%Cu lines. The model includes the coarsening and pinning of Al2Cu precipitates which occur during normal grain growth. This model is used to explore how Cu-rich precipitates evolve during normal grain growth, and how they affect the evolution of grain structure from polycrystalline to bamboo.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 472: Symposium I – Polycrystalline Thin Films - Structure, Texture, Properties..III , 1997 , 191
Copyright
Copyright © Materials Research Society 1997

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References

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