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Selective Metallization of CVD Diamond Films

Published online by Cambridge University Press:  25 February 2011

J. M. Calvert ,
P. E. Pehrsson ,
C. S. Dulcey  and
M. C. Peckerar
J. M. Calvert
Affiliation:
Center for Bio/Molecular Science and Engineering, Code 6090, Naval Research Laboratory, Washington, DC 20375–5000
P. E. Pehrsson
Affiliation:
Chemistry Division, Code 6174, Naval Research Laboratory, Washington, DC 20375–5000
C. S. Dulcey
Affiliation:
Center for Bio/Molecular Science and Engineering, Code 6090, Naval Research Laboratory, Washington, DC 20375–5000
M. C. Peckerar
Affiliation:
Nanoelectronics Process Facility, Code 6804, Naval Research Laboratory, Washington, DC 20375–5000
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Abstract

A process has been developed for the deposition of patterned adherent metal on diamond substrates using low temperature processing conditions. CVD diamond films on Si wafers were oxidized with an RFO2 plasma and subsequently functionalized by attachment of self-assembled ultrathin films (UTFs) to the oxidized diamond surface. The UTFs were exposed to patterned deep UV radiation, and selectively metallized by electroless (EL) deposition. EL Ni and Co patterns, with feature sizes to 20 μm linewidth have been produced. Oxidized and UTF-modified surfaces were characterized by surface spectroscopie and wettability techniques. The EL metal deposits on the diamond substrate passed the Scotch tape adhesion peel test.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 260: Symposium C – Advanced Metallization and Processing for Semiconductor Devices and Circuits , 1992 , 905
Copyright
Copyright © Materials Research Society 1992

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References

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