Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Kasai, Toshi
and
Bhushan, Bharat
2008.
Physics and tribology of chemical mechanical planarization.
Journal of Physics: Condensed Matter,
Vol. 20,
Issue. 22,
p.
225011.
Zhang, Xi Hui
and
Wang, Gui Xiang
2012.
Study of Chelating Agents in Silicon Wafer Polishing Slurry.
Advanced Materials Research,
Vol. 581-582,
Issue. ,
p.
790.
Shi, Junqin
Fang, Liang
Sun, Kun
Peng, Weixiang
Ghen, Juan
and
Zhang, Meng
2020.
Surface removal of a copper thin film in an ultrathin water environment by a molecular dynamics study.
Friction,
Vol. 8,
Issue. 2,
p.
323.
Liu, Jinwei
Jiang, Liang
Wu, Hanqiang
Zhong, Xia
and
Qian, Linmao
2021.
Performance of Carboxyl Groups in Chemical Mechanical Polishing of GCr15 Bearing Steel: Effects of Carbon Chain Length and pH.
Tribology Letters,
Vol. 69,
Issue. 4,
Yan, Han
Niu, Xinhuan
Qu, Minghui
Luo, Fu
Zhan, Ni
Liu, Jianghao
and
Zou, Yida
2023.
A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits.
The International Journal of Advanced Manufacturing Technology,
Vol. 125,
Issue. 1-2,
p.
47.
Li, Yanpei
Xi, Mengfei
Jiang, Bowen
Li, Xing’ai
Zhang, Yanfeng
and
Zhang, Zefang
2023.
Structure-Performance Relationships of Complexing Agents on the Chemical Mechanical Polishing of 6063 Aluminum Alloy.
ECS Journal of Solid State Science and Technology,
Vol. 12,
Issue. 4,
p.
044001.
Yan, Han
Niu, Xinhuan
Luo, Fu
Qu, Minghui
Zhan, Ni
Liu, Jianghao
and
Zou, Yida
2023.
Surface Corrosion Inhibition Effect and Action Mechanism Analysis of 5-Methyl-Benzotriazole on Cobalt-Based Copper Film Chemical Mechanical Polishing for GLSI.
ECS Journal of Solid State Science and Technology,
Vol. 12,
Issue. 4,
p.
044007.