Hostname: page-component-54dcc4c588-b5cpw Total loading time: 0 Render date: 2025-09-11T10:13:20.194Z Has data issue: false hasContentIssue false
  • English
  • Français

Resonance Method: An Attractive Way to Evaluate Mechanical Properties of Thin Gold Films

Published online by Cambridge University Press:  10 February 2011

P. Attia  and
P. Hesto
P. Attia
Affiliation:
Institut d'Electronique Fondamentale, URA 022, Université Paris XI, 91405 Orsay Cedex, France. Patrick.attia@ief.u-psud.fr
P. Hesto
Affiliation:
Institut d'Electronique Fondamentale, URA 022, Université Paris XI, 91405 Orsay Cedex, France. Patrick.attia@ief.u-psud.fr
Get access

Abstract

Micromechanical test structures have been developed for evaluating mechanical properties of thin gold films. Using micromachining techniques, gold cantilever beams of different geometry (typically 40 to 100-µm-long, 2-µm-thick and around 1-µm-wide), were fabricated. These cantilevers were resonated by electrical excitation in a scanning electron microscope (SEM) and Young's modulus, Q-factor and fatigue properties were deduced from these experiments. The longest cantilevers showed a slight upward curvature which allowed the internal stress gradient to be evaluating.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 518: Symposium N – Microelectromechanical Structures for Materials Research , 1998 , 3
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1 Attia, P., Tremblay, G., Laval, R., Hesto, P., Material Science and Engineering B : Solid State Materials for Advanced Technology, Vol. B51, Nos. 1-3, February 1998, pp. 263–266.Google Scholar
2 Chu, W.H., Mehregany, M., IEEE Transactions on Electron Devices, Vol. 40, No. 7, July 1993, pp. 1245–1250.Google Scholar
3 Boutry, M., Bosseboeuf, A., Coffignal, G., Proc. SPIE-Micromachining and microfabrication, Austin (USA), 1996, pp. 126–134.Google Scholar
4 Neugebauer, C.A., J. Appl. Phys., Vol. 31, No 6, June 1960, pp. 1096–1101.Google Scholar
5 Nix, W. D., Mettallurgical Transaction A, Vol. 20A, November 1989, pp. 2217–2245.Google Scholar
6 Weihs, T.P., Hong, S., Bravman, J.C., Nix, W.D., J. Mater. Res. 3 (5), Sep/Oct 1988, pp. 931–942.Google Scholar
7 Petersen, K.E., Guarnieri, C.R., J. Appl. Phys. 50 (11), November 1979, pp. 6761–6766.Google Scholar
8 Landau, L., Lifchitz, E., in : MIR (Ed.), Théorie de l'élasticité, pp. 151.Google Scholar
9 Attia, P., Hesto, P., Microelectronics Journal (in press).Google Scholar
10 Nathnson, H.C., Newell, W.E., Wickstrom, R.A., Davis, J.R., IEEE Transactions On Electron Devices, Vol. ED–14, No 3, March 1967, pp. 117–133.Google Scholar
11 Kiesewetter, L., Zhang, J.M., Sensors and Actuators A, 35 (1992), pp. 153–159.Google Scholar
12 Stemme, G., J. Micromech. Microeng. 1 (1991), pp. 113–125.Google Scholar
13 Ogo, I., Miller, S.A., MacDonald, N.C., Proc. Actuator 94, pp. 91–95.Google Scholar