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A Perturbation-Based Method for Extracting Elastic Properties during Spherical Indentation of an Elastic Film/Substrate Bilayer

Published online by Cambridge University Press:  01 February 2011

Jae Hun Kim ,
Andrew Gouldstone  and
Chad S. Korach
Jae Hun Kim
Affiliation:
jkim13@bidmc.harvard.edu, Stony Brook University, Materials Science and Engineering, Stony Brook, New York, United States
Andrew Gouldstone
Affiliation:
bubbleraft@gmail.com, Northeastern University, Mechanical and Industrial Engineering, Boston, Massachusetts, United States
Chad S. Korach
Affiliation:
ckorach@notes.cc.sunysb.edu, Stony Brook University, Mechanical Engineering, Stony Brook, New York, United States
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Abstract

Accurate mechanical property measurement of films on substrates by instrumented indentation requires a solution describing the effective modulus of the film/substrate system. Here, a first-order elastic perturbation solution for spherical punch indentation on a film/substrate system is presented. Finite element method (FEM) simulations were conducted for comparison with the analytic solution. FEM results indicate that the new solution is valid for a practical range of modulus mismatch, especially for a stiff film on a compliant substrate.

Keywords

thin filmelastic propertiesmicroelectro-mechanical (MEMS)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1139: Symposium GG – Microelectromechanical Systems–Materials and Devices II , 2008 , 1139-GG03-42
Copyright
Copyright © Materials Research Society 2009

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References

REFERENCES

1. Doerner, M. F. and Nix, W. D., J. Mater. Res. 1, 601 (1986).Google Scholar
2. King, R. B., Int. J.Solids. Struct. 23, 1657 (1987).Google Scholar
3. Jung, Y. G., Lawn, B. R., Martyniuk, M., Huang, H. and Hu, X. Z., J.Mater. Res. 19, 3076 (2004).Google Scholar
4. Gao, H. J., Chiu, C. H. and Lee, J., Int. J.Solids Struct. 29, 2471 (1992).Google Scholar
5. Mencik, J., Munz, D., Quandt, E., Weppelmann, E. R. and Swain, M. V., J. Mater. Res. 12, 2475 (1997).Google Scholar
6. Xu, H. T. and Pharr, G. M., Scripta Mater. 55, 315 (2006).Google Scholar
7. Perriot, A. and Barthel, E., J.Mater. Res. 19, 600 (2004).Google Scholar
8. Clifford, C. A. and Seah, M. P., Nanotechnology 17, 5283 (2006).Google Scholar
9. Hsueh, C. H. and Miranda, P., J.Mater Res. 19, 94 (2004).Google Scholar
10. Kim, J., Korach, C.S. and Gouldstone, A., Accepted in J.Mater. Res (2008).Google Scholar
11. Johnson, K.: Contact Mechanics (Cambridge University Press, New York, 1985).Google Scholar
12. Pane, I. and Blank, E., Surf.Coat. Tech. 200, 1761 (2005).Google Scholar
13. Maugis, D.: Contact, adhesion, and rupture of elastic solids (Springer, Berlin, 2000).Google Scholar