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Performance Optimization of Woven Fabric Composites for Printed Circuit Boards

Published online by Cambridge University Press:  25 February 2011

Tsu-Wei Chou  and
Jenn-Ming Yang
Tsu-Wei Chou
Affiliation:
Center for Composites Manufacturing Science and Engineering University of Delaware, Newark, Delaware 19716
Jenn-Ming Yang
Affiliation:
Center for Composites Manufacturing Science and Engineering University of Delaware, Newark, Delaware 19716
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Abstract

Woven fabric composites have been used extensively as substrate materials for multilayer printed circuit boards. This paper presents a brief overview of the recent accomplishments in the modeling and characterization of woven fabric composites. Three analytical models have been developed to predict the thermo-mechanical properties of fabric composites with various weaving geometries. A three-dimensional finite element analysis has also been adopted to determine the properties of plain-weave fabric composites.

Parametric studies are performed for both hybrid and non-hybrid woven fabric composites to generate data for materials selection and design. These data are presented in the form of “structure-performance maps” where the unique characteristics and relative effectiveness of various woven fabric composites can be easily assessed. The potential of tailoring a low thermal expansion coefficient substrate material through suitable materials selection, geometrical design, and fiber hybridization is also discussed.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 163
Copyright
Copyright © Materials Research Society 1986

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