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Passivating Organic Coatings with Silicone Gels: The Correlation Between the Material Cure & its Electrical Reliability

Published online by Cambridge University Press:  21 February 2011

C. P. Wong
C. P. Wong*
Affiliation:
AT&T Bell Laboratories, P. O. Box 900, Princeton, New Jersey 08540
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Abstract

Silicone gels are becoming some of the most accepted protective coatings for VLSI integrated circuits due to their excellent electrical, thermal, and soft gel-like nature and properties, as well as their ultra-purity and ability to protect IC devices against severe environments. Recent studies indicate that proper IC Chip surface protection with high performance silicone gels in low-cost, non-hermetic plastic packaging might well replace the conventional hermetic ceramic packaging. This paper describes the use of the soft silicone gels and coatings in IC devices. It also describes the correlation between the material cure temperature and cure time versus their adhesion and electrical reliability during 85°C, 85% RH and bias accelerating testing.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 195
Copyright
Copyright © Materials Research Society 1989

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References

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