Hostname: page-component-745bb68f8f-b6zl4 Total loading time: 0 Render date: 2025-01-27T13:44:18.147Z Has data issue: false hasContentIssue false
  • English
  • Français

Optical Waveguides in the Computer Environment a Packaging Perspective

Published online by Cambridge University Press:  21 February 2011

Modest M. Oprysko
Modest M. Oprysko*
Affiliation:
IBM Research Division, T.J. Watson Research Center, Yorktown Heights, NY 10598
Get access

Extract

Fiber optics has had a major impact on the technology of the telecommunications industry but has made little impact on the computer industry. One reason for this is the incompatability of present day optoelectronic component packaging technology with the needs of the computer industry. This problem is most evident in high-performance computer packaging.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 61
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] “Thermal Conduction Module: A High-Performance Multilayer Ceramic Package”, Blodgett, J., and Barbour, D.R., IBM J. Res. and Develop. 26, (1982) 30 Google Scholar
[2] Microelectronic Packaging Handbook, Tummala, R.R., and Rymaszewski, E.J. editors, Van Nostrand Reinhold, NY 1989 Google Scholar
[3] “OEIC Technology and its Application to Subscriber Loops”, Horimatsu, T., and Sasaki, M., J. Lightwave Technol., vol. LT–7, pg. 1612, (1989)Google Scholar
[4] “Optoelectronic Circuits for High Speed Computer Networks”, Crow, J.D., Optical Fiber Communications Conference, Tech. Digest, Houston, 1989 Google Scholar
[5] “Packaging for a 1 Gb/s OEIC Fiber Optic Data Link”, Jackson, K.P., Flint, E., Cina, M., Moll, A., Ewen, J.F., Flagello, D., Rand, R., and Purushothaman, S., Proceedings of Electronic Component Conference, Houston, 1989 Google Scholar
[6] “A New Self-Aligned Technique for the Assembly of Integrated Optical Devices with Optical Fibre and Electrical Interfaces”, Wale, M.J., Edge, C., Randle, F.A., and Pedder, D.J., 15th European Conference on Optical Communication (ECOC) 1989 Gothenberg, SwedenGoogle Scholar
[7] Optical Integrated Circuits, Nishihara, H., Haruna, M., and Suhara, T., McGraw Hill, NY, 1989 Google Scholar
[8] “Integrated Optical Devices Based on Silica Waveguide Technologies”, Miyashita, T., Sumida, S., and Sakaguchi, S., Proceedings SPIE vol. 993, pg. 288 (1988)Google Scholar
[9] “Fabrication and Characterization of Buried Singlemode Waveguides and Couplers Made by Ion Exchange in Glass”, Nissim, C., Beguin, A., Jansen, R., and Laborde, P., Proceedings Optical Fiber Conference, Houston, 1989 Google Scholar
[10] “Polymer Waveguide-Based Optical Backplane for Fine- Grained Computing”, Bristow, J.P.G., Sullivan, C.T., Guha, A., Ehramjian, J., and Husain, A., Proceedings SPIE vol. 1178, Boston (1989)Google Scholar
[11] “Board Level High Speed Photonic Interconnections: Recent Technology Developments”, Hartman, D.H., Lalk, G.R., and Banwell, T.C., SPIE vol.994, pg. 57 Boston (1988)Google Scholar
[12] “Polymeric Optical Waveguides”, Hagerhorst-Trewhella, J.M., Gelorme, J.D., Fan, B., Speth, A., Flagello, D., and Oprysko, M.M., Proceedings SPIE, vol. 1177, Boston (1989)Google Scholar
[13] “Waveguides in Acrylate Photopolymerizable Monomer Systems”, Booth, B.L., and Marchegiano, J.E., Proceedings Conference on Lasers and Electro-Optics, Baltimore, 1989 Google Scholar
[14] “Glass Waveguides on Silicon for hybrid Optical Packaging”, Henry, C.H., Blonder, G.E., and Kazarinov, R.F., J. Lightwave Technol. vol. LT–7, pg. 1530 (1989)Google Scholar