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Observation and Modelling of Electromigration-Induced Void Growth In AI-Based Interconnects

Published online by Cambridge University Press:  15 February 2011

O. Kraft ,
S. Bader ,
J.E. Sanchez Jr.  and
E. Arzt
O. Kraft
Affiliation:
Max-Planck-Institut für Metallforschung, and Institut für Metallkunde, University of Stuttgart, D-7000 Stuttgart, Germany;
S. Bader
Affiliation:
Max-Planck-Institut für Metallforschung, and Institut für Metallkunde, University of Stuttgart, D-7000 Stuttgart, Germany;
J.E. Sanchez Jr.
Affiliation:
Advanced Micro Devices, Sunnyvale, CA 94088, USA
E. Arzt
Affiliation:
Max-Planck-Institut für Metallforschung, and Institut für Metallkunde, University of Stuttgart, D-7000 Stuttgart, Germany;
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Abstract

Accelerated electromigation tests on unpassivated, pure aluminum interconnects were performed. The failure mechanisms were observed by interrupting the tests and examining the conductor lines using an SEM. Because the metal thin film was subjected to a so-called laser reflow process before patterning, grain boundaries were visible in the SEM as thermal grooves. Voids were observed to move along the line and to grow in a transgranular manner, and a characteristic asymmetric void shape was identified which seems to be related to the failure mechanism. It is argued that substantial progress in modelling and understanding of electromigration failure can be made by consideration of such void shape effects.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 267
Copyright
Copyright © Materials Research Society 1993

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References

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