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Near-Field Ultrasonic Imaging: A Novel Method for Nondestructive Mechanical Imaging of IC Interconnect Structures

Published online by Cambridge University Press:  01 February 2011

G. S. Shekhawat ,
H. Xie ,
Y. Zheng  and
R. E. Geer
G. S. Shekhawat
Affiliation:
University at Albany Institute for Materials, Albany, NY 12222
H. Xie
Affiliation:
University at Albany Institute for Materials, Albany, NY 12222
Y. Zheng
Affiliation:
University at Albany Institute for Materials, Albany, NY 12222
R. E. Geer
Affiliation:
University at Albany Institute for Materials, Albany, NY 12222
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Abstract

The investigation of an alternate approach to nondestructive, nanoscale mechanical imaging for IC interconnect structures is reported. This approach utilizes a heterodyne interferometer based on a scanning probe microscope, also referred to as heterodyne force microscopy (HFM). This interferometer is sensitive to the relative phase difference of the two ultrasonic excitations due to spatial variations in the sample viscoelastic response and enables near-field, phase-sensitive imaging. Proof-of-feasibility demonstrations of this technique are presented for ultrasonic phase-imaging of Al/low-k interconnect structures. Spatial resolution <10 nm is demonstrated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 716: Symposium B – Silicon Materials-Processing, Characterization, and Reliability , 2002 , B11.14
Copyright
Copyright © Materials Research Society 2002

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