Published online by Cambridge University Press: 10 February 2011
Fracture in amorphous silica is studied using million-atom molecular dynamics simulations. The dynamics of crack propagation, internal stress fields, and the morphology of fracture surfaces are examined as a function of temperature and strain rate. At 300K and 600K we observe brittle fracture: internal stress increases to a critical value (typically 2 – 3 GPa) and then turns over when the crack reaches a terminal speed on the order of half the Rayleigh wave speed. At 900K crack propagation slows down dramatically due to plastic deformation and the material becomes ductile.