Hostname: page-component-7dd5485656-7jgsp Total loading time: 0 Render date: 2025-10-31T05:58:31.244Z Has data issue: false hasContentIssue false
  • English
  • Français

Models for the Thermomechanical Behavior of Metal/Ceramic Laminates

Published online by Cambridge University Press:  15 February 2011

S. M. Spearing ,
M. A. Tenhover ,
D. B. Lukco ,
L. Viswanathan  and
D. K. Hollen
S. M. Spearing
Affiliation:
Carborundum Microelectronics, Phoenix AZ
M. A. Tenhover
Affiliation:
Carborundum Technology Division, Niagara Falls, NY
D. B. Lukco
Affiliation:
Carborundum Technology Division, Niagara Falls, NY
L. Viswanathan
Affiliation:
Carborundum Microelectronics, Phoenix AZ
D. K. Hollen
Affiliation:
Carborundum Microelectronics, Phoenix AZ
Get access

Abstract

Metal/ceramic bilayers fracture by one of three failure modes; crazing, spalling or interfacial failure. Models for these failure modes are developed. The results are presented as maps that can be used in the design and failure analysis of electronic packages. Examples are presented for several material systems, including A1N.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 125
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

[1] Tummmala, R. R. and Rymaszewski, E. J. Microelectronics Packaging Handbook, (Van Nostrand Reinhold) 1989.Google Scholar
[2] Suhir, E. in Mechanical Behavior of Materials and Structures in Microelectronics, edited by Suhir, E., Cammarata, R. C., Chung, D. D. L. and Jono, M., (Mater. Res. Soc. Proc. 226, Anaheim, CA 1991) pp. 269–77.Google Scholar
[3] Hutchinson, J. W. and Suo, Z., Advances in Applied Mechanics 29, 63–191 (1991).CrossRefGoogle Scholar
[4] Hu, J. M., Pecht, M. and Dasgupta, A., Int. J. Microcircuits and Electronic Packaging. 16 1–15 (1993).Google Scholar
[5] Drory, M. D., Thouless, M. D. and Evans, A. G., Acta Metall. 36 2019–28 (1986).CrossRefGoogle Scholar
[6] Suo, Z. and Hutchinson, J. W., Int. J. Solids Structures 25 1337–53 (1989).CrossRefGoogle Scholar
[7] Dundurs, J. J., J. Appl Mech., 36 650–52 (1969).CrossRefGoogle Scholar
[8] Timoshenko, S., J. Opt. Soc of America, 11, 233–55 (1925)CrossRefGoogle Scholar
[9] Reimanis, I. E., Dalgleish, B. J. and Evans, A. G., Acta Metall. 39 3133–41 (1991).CrossRefGoogle Scholar
[10] Dalgleish, B. J., Lu, M. C. and Evans, A.G., Acta Metall. 36 2029–35 (1988).CrossRefGoogle Scholar