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Microwave Processing of Polyimide Thin Films

Published online by Cambridge University Press:  15 February 2011

David A. Lewis ,
Susan J. Lamaire  and
Thomas Nunes
David A. Lewis
Affiliation:
IBM Corp., T.J. Watson Research Center, P.O. Box 218, Yorktown Heights, NY 10598.
Susan J. Lamaire
Affiliation:
IBM Microelectronics, Hopewell Jnct., NY
Thomas Nunes
Affiliation:
IBM Microelectronics, Hopewell Jnct., NY
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Abstract

Microwave processing has been used to reduce the long process cycles normally associated with the curing cycles for highly ordered polyimides, such as BPDA-PDA. These materials have found applications in the electronics industry due to the excellent thermal stability and low coefficient of thermal expansion of this class of polymers. Thin polymer films - an application not normally considered for microwave curing - were processed and the dependence of the mechanical properties compared with conventional thermal processing.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 347: Symposium O – Microwave Processing of Materials IV , 1994 , 681
Copyright
Copyright © Materials Research Society 1994

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References

1. Lewis, D. A., Ward, T. C., Summers, J. D. and McGrath, J. E., Polym. Prepr. 29, 174–175 (1988).Google Scholar
2. Lewis, D. A., Ward, T.C, Summers, J. D. and McGrath, J. E., J. Polym. Sci., Polym. Chem. Ed. 30, 1647–1653 (1992).Google Scholar
3. Wei, J., Hawley, M. and DeMeuse, M., PMSE Prepr. 66, 478–479 (1992).Google Scholar
4. Marand, E., Baker, K. R. and Graybeal, J. D., Macromolecules 25, 2243–2252 (1992).Google Scholar
5. Feger, C. and Feger, C., Selection Criteria for Multichip Module Dielectrics (Van Nostrana Reinhold, 1993), pp. 311–348.Google Scholar
6. Hedrick, J. C., Lewis, D. A., Lyle, G. D., Ward, T. C. and McGrath, J. E., Fourth Technical Conference, Proceedings of the American Society for Composites 167–176 (1990).Google Scholar
7. Asmussen, J., Lin, H. H., Manring, B. and Fritz, R., Rev. Sci. Instrum. 58, 1477–1486 (1987).Google Scholar
8. Poon, T. and Ho, P.. Presented at the Spring MRS, 1994 Google Scholar