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Micro-Tensile and Fatigue Testing of Copper Thin Films on Substrates

Published online by Cambridge University Press:  10 February 2011

M. Hommel ,
O. Kraft ,
S. P. Baker  and
E. Arzt
M. Hommel
Affiliation:
Max-Planck-Institut für Metallforschung, Stuttgart, Germany
O. Kraft
Affiliation:
Max-Planck-Institut für Metallforschung, Stuttgart, Germany
S. P. Baker
Affiliation:
Dept. of Materials Science & Engineering, Cornell University, Ithaca, NY, USA
E. Arzt
Affiliation:
Max-Planck-Institut für Metallforschung, Stuttgart, Germany
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Abstract

A special micro-tensile tester was used to carry out tensile tests of thin copper films on substrates. The elastic strain in the film was measured in-situ using x-ray diffraction and the total strain with an external strain gage. From the elastic strains the stresses in the films were calculated and stress-strain curves were obtained. It was observed that the flow stress increases with decreasing film thickness. The method was also applied to investigate the mechanical behavior of films under cyclic loading.

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References

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