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A Method for Analyzing the Critical Adhesion Energy of Thin Film Coatings

Published online by Cambridge University Press:  21 February 2011

Frederick J. McGarry  and
Edward O. Shaffer II
Frederick J. McGarry
Affiliation:
Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, Cambridge, MA 02139
Edward O. Shaffer II
Affiliation:
Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, Cambridge, MA 02139
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Abstract

The edge delamination test (EDT) measures the energy required to cause a thin film, under biaxial tensile stress, to debond from a rigid substrate. Circular holes are etched through the films and if the stress is large enough, stable debond rings grow radially around the holes. A finite element analysis is used to find the applied strain-energy release rate as a function of debond crack length, hole radius and side-wall angle. However, the analysis may not be widely available, so, we present tables of reduced debond energy val ues, Gr, to facilitate the use of the EDT. With observed EDT results, Gr is extrapolated from the tables and then the critical debond energy is calculated by multiplying Gr by the maximum strain energy. Also, we have fit Gr with a semi-empirical equation, which is in good agreement over a broad range of geometries.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 515
Copyright
Copyright © Materials Research Society 1995

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