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Mechanical Stress and Electromigration Failure

Published online by Cambridge University Press:  15 February 2011

J. R. Lloyd
J. R. Lloyd*
Affiliation:
Digital Equipment Corp., Hudson MA, 01749–2809
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Abstract

The role of mechanical stress in electromigration failure morphology and time to failure is discussed theoretically. It is seen that a tensile stress can accelerate failure significantly and that accelerations from test conditions are also a function of applied stress.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 225: Symposium G – Materials Reliability Issues in Microelectronics , 1991 , 47
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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