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Mechanical Reliability of Film/Substrate Systems Intended for Electronic Packaging

Published online by Cambridge University Press:  25 February 2011

A. Chouaf ,
M. Ignat ,
Ph. Norrnandon  and
J.M. Terriez
A. Chouaf
Affiliation:
Laboratoire de Thermodynamique et Physico-Chimie Métallurgiques, E.N.S.E.E.G, BP.75, 38402 Saint Martin d'Hères, France
M. Ignat
Affiliation:
Laboratoire de Thermodynamique et Physico-Chimie Métallurgiques, E.N.S.E.E.G, BP.75, 38402 Saint Martin d'Hères, France
Ph. Norrnandon
Affiliation:
CNET, BP.98 38243 Meylan Cédex, France
J.M. Terriez
Affiliation:
IUT Mécanique, Domaine Universitaire 38402 Saint Martin d'Hères, France
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Abstract

Calculations of thermoelastic internal stresses for different systems comprised of one or several films deposited on a substrate are presented. The calculated stresses are compared to stresses directly determined by deflection measurements. The film(s)/substrate systems were submitted to cyclic bending tests in order to analyse the evolution of their internal stresses. When a significant relaxation of the stresses is detected, it is discussed with respect to the activation of irreversible deformation mechanisms, which will depend on the nature of the phases constituting the system.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 177
Copyright
Copyright © Materials Research Society 1991

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References

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