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Mechanical Properties and Toughening of a Polymethylsilsesquioxane Network

Published online by Cambridge University Press:  10 February 2011

Bizhong Zhu ,
Dimitris E. Katsoulis ,
Gregg A. Zank  and
Frederick J. McGarry
Bizhong Zhu
Affiliation:
Central R&D, Dow Coming Corporation, Midland, MI 48686
Dimitris E. Katsoulis
Affiliation:
Central R&D, Dow Coming Corporation, Midland, MI 48686
Gregg A. Zank
Affiliation:
Central R&D, Dow Coming Corporation, Midland, MI 48686
Frederick J. McGarry
Affiliation:
Department of Materials Science and Engineering, MIT, Cambridge, MA 02139
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Abstract

Polysilsesquioxanes are finding wider uses in microelectronics. However these materials are brittle and their mechanical behaviors need to be better understood. In this paper the mechanical properties of a cured methyl silsesquioxane network are studied and they are found to vary strongly with curing conditions. In the investigated curing temperature range there seems to be a correlation between the fracture toughness (KIc) and the viscoelastic transitions, which are affected by the network crosslink density. A higher crosslink density suppresses the cc and β transitions and reduces the KIc. A toughening approach is designed and its applicability is demonstrated by the increased fracture toughness.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 594: Symposium V – Thin Films - Stresses & Mechanical Properties VIII , 1999 , 257
Copyright
Copyright © Materials Research Society 2000

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References

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