Hostname: page-component-669899f699-vbsjw Total loading time: 0 Render date: 2025-04-26T04:43:49.322Z Has data issue: false hasContentIssue false
  • English
  • Français

Mechanical Characterization and Constitutive Description of Thin-Film Polymeric Materials

Published online by Cambridge University Press:  15 February 2011

T. Y. Wu  and
D. L. Questad
T. Y. Wu
Affiliation:
Packaging Technology and Process Development Technology Products IBM Corporation, Endicott, NY 13760
D. L. Questad
Affiliation:
Packaging Technology and Process Development Technology Products IBM Corporation, Endicott, NY 13760
Get access

Abstract

Mechanical properties of thin-film polymers often dictate the mechanical integrity and performance of microelectronic assemblies. For example, excessive interfacial stress between the polymer and signal via induced by thermal mismatch will lead to delamination of the interface or via cracking. This type of problem becomes more aggravated as dimensions of assemblies continue to shrink. In order to define the optimal design variables and process windows, the mechanical properties of polymer thin films throughout the complete process cycle must be carefully characterized. This paper will first review the experimental techniques commonly adopted in the mechanical measurements of thin-film polymers. Then, it will focus on the most difficult part of the mechanical characterization which is along the out-of-plane (Z) direction. Experimental set-up using the capacitance gauge will be introduced. Critical mechanical properties of polymers will be discussed. For the purpose of illustration, two polymers are chosen as examples. A BPDA-PDA polyimide is used to demonstrate mechanical characterization before melting whereas a PTFE-SiO2 composite is chosen to demonstrate the rheological characterization after melting. Before melting, mechanical behaviors such as the stress-strain curve, creep, relaxation, coefficient of thermal expansion, strain-rate dependence, and temperature dependence are discussed. After melting, the rheological behavior and the effect of aspect ratio measured by a squeezing flow experiment are addressed. Constitutive descriptions are proposed. The functional dependency between stress (pressure), strain (displacement), time, and temperature are characterized. A comparison between the numerical simulations and the experimental measurements is also presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 143
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1. See, for instance, Chang, C. S., ”Printed Circuit Board Signal Line Electrical Design” in Principles of Electronic Packaging, edited by Seraphim, D.P., Lasky, R., and Li, C. Y., (McGraw-Hill, New York, 1989), p. 104.Google Scholar
2. Jaccodine, R. J. and Schlegel, W. A., J. Appl. Phys. 31, 1096 (1960).Google Scholar
3. Allen, M. G., Mdhregany, M., Howe, R. T., and Senturia, S. D., Appl. Phys. Lett. 51 (4), 241 (1987).Google Scholar
4. Maseeh, F. and Senturia, S. D., in Proceedings of the 1990 IEEE Solid State Sensor and Actuator Workshop, IEEE, Piscataway, New Jersy, 1990, p. 55.Google Scholar
5. Maden, M. A. and Farris, R. J., Mat. Res. Soc. Symp. (1989).Google Scholar
6. Bauer, H. J. and Buckel, W., Helv. Phys. Acta 41, 674 (1968); H. J. Bauer and W. Buckel, Z. Phys. 216, 507 (1968); H. J. Bauer and W. Buckel, Z. Phys. 220, 293 (1969).Google Scholar
7. Buck, V., Z. Phys. B-Condens. Matter 33, 349 (1979); V. Buck and G. Priffer, Z. Phys. B-Condens. Matter 43, 229 (1981).Google Scholar
8. Vreeland, T. Jr., and Paine, B. M., J. Vac. Sci. Technol. A 4, 3153 (1986).Google Scholar
9. Moske, M. and Samwer, K., Rev. Sci. Instrum. 59 (9), 2012 (1988).CrossRefGoogle Scholar
10. Schweitz, J. Å., J. Micromech Microengineering 1 (1), 10 (1991).Google Scholar
11. Moske, M., Lewis, J. E., and Ho, P. S., Proceedings of “In Search of Excellence Annual Technical Conference,” (ANTEC - Soc. of Plastic Engineers 37, Brookfield, CT 1991) p. 1731.Google Scholar
12. Frye, G. C. and Martin, S. J., Appl. Spectroscopy Reviews, 26 (1&2), 73 (1991).Google Scholar
13. Howe, R. T. and Muller, R. S., J. Appl. Phys. 54 (8), 4674 (1983).Google Scholar
14. Petersen, K. E. and Guarnieri, C. R., J. Appl. Phys. 50 (11), 6761 (1979).Google Scholar
15. Tong, H. M., Saenger, K. L., and Su, G. W., Proceedings of “In Search of Excellence Annual Technical Conference,” (ANTEC - Soc. of Plastic Engineers 37, Brookfield, CT 1991) p. 1727.Google Scholar
16. Moske, M., Ho, P. S.,Sachdev, K. (private communication).Google Scholar
17. Dion, J., Yost, B., Borgesen, P., and Li, C. Y., Proceedings of the 1992 Joint ASMEIJSME Conference on Electronic Packaging, 2, Milpitas, California, 1992, p. 633.Google Scholar
18. Kim, K.S., Mat. Res. Soc. Symp. Proc. 203, 1991, p. 3.Google Scholar
19. Chen, S. T. (private communication).Google Scholar
20. Ferry, J. D., ”Viscoelastic Properties of Polymers,” 2nd ed. (John Wiley, New York, 1970), p.270.Google Scholar
21. Tanaka, H. and White, J. L., Polym. Eng. Sci., 20 (14), 949 (1980).Google Scholar
22. Suetsugu, Y., White, J. L., J. Appl. Polym. Sci., 28, 1481 (1983).Google Scholar
23. Tungare, A., Martin, G., Gotro, J., Polym. Eng. Sci., 26, 1071 (1988).Google Scholar
24. Bird, R. B., Armstrong, R. C. and Hassager, O., “Dynamics of Polymeric Liquids,” Vol.1 (John Wiley, New York, 1977), pp. 19–21 and 223–226.Google Scholar