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Measurement and Analysis of Structural Damping in Silicon Carbide Microresonators

Published online by Cambridge University Press:  01 February 2011

Sairam Prabhakar ,
Frederic Nabki ,
Mourad El-Gamal  and
Srikar Vengallatore
Sairam Prabhakar
Affiliation:
sairam.prabhakar@mail.mcgill.ca, McGill University, Mechanical Engineering, Montreal, Canada
Frederic Nabki
Affiliation:
frederic.nabki@mail.mcgill.ca, McGill University, Electrical and Computer Engineering, Montreal, Canada
Mourad El-Gamal
Affiliation:
mourad.el-gamal@mcgill.ca, McGill University, Electrical and Computer Engineering, Montreal, Canada
Srikar Vengallatore
Affiliation:
srikar.vengallatore@mcgill.ca, McGill University, Mechanical Engineering, Montreal, Canada
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Abstract

The design of microresonators with high natural frequencies (1 MHz to 1 GHz) and low structural damping is essential for devices used for applications in communications. Here, we report experimental measurements of damping at low pressure and ambient temperature in electrostatically-actuated, metallized silicon carbide microresonators. Comparison of the measured values with the predictions of a model for thermoelastic damping indicates that the contribution of this mechanism to the measured damping ranges from 10% to 50% over a broad frequency range (3 MHz to 30 MHz).

Keywords

internal frictionmicroelectro-mechanical (MEMS)thin film

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1139: Symposium GG – Microelectromechanical Systems–Materials and Devices II , 2008 , 1139-GG03-04
Copyright
Copyright © Materials Research Society 2009

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References

REFERENCES

[1] Nabki, F., Dusatko, T.A., Vengallatore, S., and El-Gamal, M.N., Tech. Dig. Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head, SC, pp. 216–219, 2008.Google Scholar
[2] Crocker, J., Sosale, G., and Vengallatore, S., Proceedings of the 21st Canadian Congress of Applied Mechanics (CANCAM), June 3–7, 2007, Toronto, Canada.Google Scholar
[3] Bishop, J.E. and Kinra, V.K., Int. J. Solids Structures, 34, 1075 (1997).Google Scholar
[4] Vengallatore, S. J. Micromech. Microeng., 15, 2398 (2005).Google Scholar
[5] Prabhakar, S., and Vengallatore, S., J. Micromech. Microeng., 17, 532 (2007).Google Scholar
[6] Ozisik, M.N., Heat Conduction, (John Wiley and Sons, New York, 1993)Google Scholar
[7] Boley, B.A. and Weiner, J.H., Theory of Thermal Stresses, (Wiley, New York, 1960).Google Scholar
[8] Press, W.H., Teukolsky, S.A., Vetterling, W.T. and Flannery, B.P., Numerical Recipes in C++: The Art of Scientific Computing, (Cambridge University Press, Cambridge, 2002).Google Scholar