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Materials, Mechanical, and Thermal Considerations of High Density Multi-Chip Electronic Packages

Published online by Cambridge University Press:  21 February 2011

J. Peter Krusius
J. Peter Krusius*
Affiliation:
Cornell University, School of Electrical Engineering, Ithaca, New York 14853-5401, USA
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Abstract

Multi-chip packages (MCP) are analyzed for high density CMOS packaging using package system simulation, a new systematic methodology for design and trade-off studies of electronic packages. Technology parameters for a representative CMOS chip, multi-chip package, and printed wiring board technology are defined. The effect of these technology parameters on the characteristics of the MCP are examined. The MCP's are optimized using simulated annealing. A large set of optimum MCP's has been found. Based on this set, MCP technology parameters are ranked and their implications on future high density MCP's discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 23
Copyright
Copyright © Materials Research Society 1990

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References

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