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Low-Temperature Grain Boundary Diffusion Data Measured from Historical Artifacts

Published online by Cambridge University Press:  01 February 2011

R.J. Kremer ,
M.A. Dayananda  and
A.H. King
R.J. Kremer
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, IN 47907–2044
M.A. Dayananda
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, IN 47907–2044
A.H. King
Affiliation:
School of Materials Engineering, Purdue University, West Lafayette, IN 47907–2044
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Abstract

Diffusion processes in typical metals are slow at room temperature but there are many applications for which very long-term use is envisaged and stability needs to be assured over a timescale of 10, 000 years, where even slow processes can be important. It is common to perform accelerated tests at higher temperatures and extrapolate the necessary information from the measurements so obtained. We have tested the validity of this type of extrapolation for room-temperature, grain boundary diffusion in the copper-silver system, by measuring low-temperature diffusion profiles in antique samples of Sheffield plate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 852 , 2004 , OO1.5
Copyright
Copyright © Materials Research Society 2005

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References

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