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Published online by Cambridge University Press: 26 February 2011
Experiments were performed to investigate the pulsed excimer laser etching of a chlorinated copper substrate. Time-of-flight mass spectrometric techniques were employed to characterize the mass and velocity distributions of both neutral and ionic species that desorb at laser fluences less than that required to melt bulk Cu or CuCl substrates. The presence of positively charged ions in this work is examined in terms of both photon and electron mediated desorption mechanisms.