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Low Temperature Die Attach Material

Published online by Cambridge University Press:  21 February 2011

Mark A. Blocker ,
Tom L. Herrington  and
My N. Nguyen
Mark A. Blocker
Affiliation:
Johnson Matthey Electronics, Inc., 10080 Willow Creek Road, San Diego, CA 92131
Tom L. Herrington
Affiliation:
Johnson Matthey Electronics, Inc., 10080 Willow Creek Road, San Diego, CA 92131
My N. Nguyen
Affiliation:
Johnson Matthey Electronics, Inc., 10080 Willow Creek Road, San Diego, CA 92131
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Abstract

A new silver lead phosphovanadate glass die attach material is discussed. Its sintering characteristics are examined by dilatometry and the organic system by thermo gravimetric analysis. Sintering is found to occur at lower temperature than conventional silver glass systems. This is caused by reaction between silver and one of the glass components during heat treatment. The vehicle is found to evaporate faster allowing void free processing for large area dice.

The new glass combined with a more volatile organic system has produced a single pass die attach material which can be fired as low as 360°C.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 199
Copyright
Copyright © Materials Research Society 1990

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References

[1] Nguyen, M. N., “Low Stress Silver-Glass Die Attach Material”, Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium Proceedings, San Francisco, CA 1989.Google Scholar
[2] European Patent #88312052.9Google Scholar
[3] Herrington, T. L., Ferrier, G. G., Smith, H. L., “Low Temperature Silver Glass Die Attach Material”, Ninth Annual International Electronics Packaging Conference, San Diego, CA 1989.Google Scholar
[4] Chung, Y. S., Kim, H. G., “Effect of Oxide Glass on the Sintering Behavior and Electrical Properties of Thick Film”, IEEE Transaction on CHMT, 11, 195 (1988).Google Scholar
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[6] Owens, N. L., “Silver Glass Die Attach and Larger Die”, Microelectronic Manufacturing and Testing, April, 1988.Google Scholar