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Low Si-OH ORMOCER®s for Dielectrical and Optical Interconnection Technology

Published online by Cambridge University Press:  01 February 2011

Ralf Buestrich ,
Frank Kahlenberg ,
Michael Popall ,
Adelheid Martin  and
Oliver Rösch
Ralf Buestrich
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-97082 Würzburg, Germany
Frank Kahlenberg
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-97082 Würzburg, Germany
Michael Popall*
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-97082 Würzburg, Germany
Adelheid Martin
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-97082 Würzburg, Germany
Oliver Rösch
Affiliation:
Robert Bosch GmbH, D-70049 Stuttgart, Germany
*
# Author to whom correspondence should be addressed
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Abstract

ORMOCER®*s (inorganic-organic hybrid polymers) with low Si-OH content were synthesized by a new sol-gel route. Optimization of the sol-gel process parameters (catalyst, temperature etc.) was performed in order to achieve reproducible low cost materials which are photo-patternable even in higher layer thicknesses up to 150 μm within one step without cracking or delamination. The materials combine low losses in the NIR region (0.2 dB/cm at 1310 nm and 0.5 dB/cm at 1550 nm without fluorination!) with low dielectric constants (3.3 at 10 kHz).

Beside the dielectric and optical properties the materials have a variety of additional advantages for interconnection technology: good wetting and adhesion on various substrates (e.g. glass, silicon and several polymers), low processing temperatures (postbake below 160 °C), high thermal stability (up to 270 °C) and a tunable refractive index.

Details of chemical synthesis and characterization as well as photo-lithographic processing of ORMOCER® materials are presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 628: Symposium CC – Hybrid Organic/Inorganic Materials , 2000 , CC9.8
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

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