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High Temperature Clay Filled Epoxy Composites

Published online by Cambridge University Press:  26 February 2011

Dharmaraj Raghavan ,
Joseph Ktoo Langat ,
Mauro Zammarano  and
Jeffrey Gilman
Dharmaraj Raghavan
Affiliation:
draghavan@howard.edu, Howard, Chemistry, 525 College Street, NW, Washington DC, DC, 20059, United States
Joseph Ktoo Langat
Affiliation:
josephlangat@gmail.com, Howard University, Department of Chemistry, 525 College Street, Washington, DC, 20059, United States
Mauro Zammarano
Affiliation:
mauro.zammarano@nist.gov, National Institute of Standards and Technology, Gaithersburg, MD, 20899, United States
Jeffrey Gilman
Affiliation:
jeffrey.gilman@nist.gov, National Institute of Standards and Technology, Gaithersburg, MD, 20899, United States
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Abstract

The primary objective of this study is to improve the thermal stability ofclay and clay filled composite. An epoxy-clay composite has been prepared bydispersing 1-hexadecyl-3-(6-hydroxyhexyl)-2-methylimidazolium modified clayin an epoxy resin and cured with metaphenylene diamine(m-PDA) at 110.0 °C for 7 h and post cured at 140°C for 4h. The thermal stability of the modified clay and clay filled epoxycomposite was characterized via thermogravimetric analysis (TGA). The onsetdecomposition temperature of the imidazolium functionalized clay was 360°C.Transmission Electron Microscopy (TEM) of the composite showed mixedmorphology with predominant fraction of intercalated clay platelets in theepoxy matrix. The onset decomposition temperature of the modified clayfilled epoxy composite was found to be higher than that of pristineepoxy.

Keywords

compositethermogravimetric analysis (TGA)morphology

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