Published online by Cambridge University Press: 28 February 2011
A supersonic free jet operated in continuous wave and pulsed mode was used to grow Ge films on (100) GaAs and (100) Si substrates. The Ge-bearing source molecule digermane (Ge2H6) was seeded (at 5% concentration) in a helium carrier gas. A free jet expansion of this gas mixture was directed toward the heated substrate surface, where Ge film growth took place by surface-induced thermal decomposition of the ballistically impinging digermane molecules. The thickness distribution across the substrate surface was fitted by a cosmJ distribution. The values of m spanned the range 6–35. The upper limit on growth resulting from “background” gas scattered out of the jet was found to be less than 10% of the Ge film thickness for growth on (100) GaAs, and around 25% for growth on (100) Si.