Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by Crossref.
Brown, D. D.
Børgesen, P.
Lilienfeld, D. A.
Korhonen, M. A.
and
Li, C.-Y.
1991.
Thermal Stress Induced Void Formation in Narrow Passivated Cu Lines.
MRS Proceedings,
Vol. 239,
Issue. ,
Rafalski, S.A.
Spreitzer, R.L.
Russell, S.W.
Alford, T.L.
Li, J.
Moinpour, M.
Moghadam, F.
and
Mayer, J.W.
1994.
Enhanced Adhesion of Copper Films to SiO2, PSG and BPSG by Refractory Metal Additions.
MRS Proceedings,
Vol. 337,
Issue. ,
Adams, D.
Spreitzer, R.L.
Russell, S.W.
Theodore, N.D.
Alford, T.L.
and
Mayer, J.W.
1994.
Effectiveness of Nitride Diffusion Barriers in a Self-Encapsulated Copper-Based Metallization..
MRS Proceedings,
Vol. 337,
Issue. ,
Kriese, M.D.
Moody, N.R.
and
Gerberich, W.W.
1998.
Effects of annealing and interlayers on the adhesion energy of copper thin films to SiO2/Si substrates.
Acta Materialia,
Vol. 46,
Issue. 18,
p.
6623.
Liu, Guanyu
Tian, Ziao
Yang, Zhenyu
Xue, Zhongying
Zhang, Miao
Hu, Xudong
Wang, Yang
Yang, Yuekun
Chu, Paul K.
Mei, Yongfeng
Liao, Lei
Hu, Weida
and
Di, Zengfeng
2022.
Graphene-assisted metal transfer printing for wafer-scale integration of metal electrodes and two-dimensional materials.
Nature Electronics,
Vol. 5,
Issue. 5,
p.
275.
Fan, Fu
Chen, Lei
Wang, Yubin
Wang, Pengshuai
Niu, Yuan
Lv, Yanting
Zhou, Yu
Shu, Zhiwen
Liu, Peng
Dong, Wanrong
Zhang, Nianqi
Li, Chaohua
and
Duan, Huigao
2025.
Damage-free dry transfer printing of ultrathin films with on-demand interfacial adhesion: principles and applications.
Soft Science,
Vol. 5,
Issue. 4,