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Experimental Measurements of Surface Residual Stress Caused by Nano-scale Contact of Rough Surfaces

Published online by Cambridge University Press:  01 February 2011

J. Wang ,
P. Shrotriya ,
H. H. Yu  and
K.-S. Kim
J. Wang
Affiliation:
Division of Engineering, Brown University, Providence, RI 02912
P. Shrotriya
Affiliation:
Division of Engineering, Brown University, Providence, RI 02912
H. H. Yu
Affiliation:
Division of Engineering, Brown University, Providence, RI 02912
K.-S. Kim
Affiliation:
Division of Engineering, Brown University, Providence, RI 02912
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Abstract

A previous dislocation model analysis predicts that nano-scale contacts of surface steps induce nucleation of dislocations leading to pro-load and anti-load dislocation segregation near the contact surface. Such dislocation segregation generates a sub-layer of tensile residual stress in a much thicker layer of compressive residual stress near the surface. The sub-layer thickness is expected to be about 50 to 100 times the step height. In order to verify the predictions of the model analysis, experiments are carried out on polycrystalline aluminum surface to determine the existence of the tensile sub-layer. The variation of the residual stress along the thickness direction is measured using a newly developed high sensitivity curvature-measurement interferometer. The interferometer measures the curvature change of the back surface of a plate specimen of about 1.9 mm thickness while the contact-loaded front surface is chemically etched. The residual stress distribution measured with sub-nanometer spatial resolution is compared with analytical predictions.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 795: Symposium U – Thin Films - Stresses and Mechanical Properties X , 2003 , U9.9
Copyright
Copyright © Materials Research Society 2004

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References

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