Published online by Cambridge University Press: 15 February 2011
In this paper, we report on a new excimer-laser crystallization (ELC) method that is highly effective in extending the super-lateral growth (SLG) distance and which does not involve any preheating of the substrate. The technique utilizes bi-directional irradiation of a dual layer Si film stack (separated by an oxide layer) deposited on a quartz wafer. The top layer is irradiated with a projection system which transfers a mask image in order to produce grain-boundary-location-controlled (GLC) regions, and the bottom layer, upon irradiation with a uniform beam, acts as a medium that favorably affects the thermal evolution of the top layer. The technique is effective and attractive in that the heating is spatially and temporally localized in an optimal manner. The thermal environment required for extending the SLG distance, as is induced by the melting and solidification of the bottom layer, is physically regulated by the melting temperature of Si, and the enthalpy difference between liquid and solid can be used to initially store and subsequently release heat. Using the method, we were able to attain GLC regions with widths up to 10 μm in 1000-Å Si films without any substrate heating. We elaborate on the applicability of the method to various artificially controlled super-lateral growth (ACSLG) techniques, and discuss process optimization by means of varying the multilayer configuration.