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Excimer Laser Applications in Integrated Circuit Packaging

Published online by Cambridge University Press:  15 February 2011

Y. F. Lu ,
M. H. Hong ,
D. S. H. Chan  and
T. S. Low
Y. F. Lu
Affiliation:
Department of Electrical Engineering, National University of Singapore, Singapore 0511
M. H. Hong
Affiliation:
Department of Electrical Engineering, National University of Singapore, Singapore 0511
D. S. H. Chan
Affiliation:
Department of Electrical Engineering, National University of Singapore, Singapore 0511
T. S. Low
Affiliation:
Magnetics Technology Centre, National University of Singapore, Singapore 0511
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Abstract

Excimer laser ablation is applied in the deflashing and demarking of IC packages. It is found that mold flash filled in the interface holes of IC leadframe can be removed completely by the laser deflashing in a short period of time. With appropriate selection of laser parameters, deflashing quality and efficiency can be greatly improved. The laser deflashing is more efficient for higher pin count packages. It is a superior alternative in future applications. In laser demarking, ink marks on package surfaces can also be removed completely in a short time. The surface after the processing has good conditions for remarking. The package remarking shows good permanency. The lifetime for good marking is much longer for IC packages after the laser demarking than those after hydrogen flame-off. Laser processing can be used to replace hydrogen flame-off in the ink printing of IC packages for high efficiency and safety.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 397: Symposium B – Advanced laser Processing of Materials-Fundamentals and Applications , 1995 , 323
Copyright
Copyright © Materials Research Society 1996

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References

REFERENCES

1 Manzione, L.T., AT&T Plastic Packaging of Microelectronic Devices, Van Nostrand Reinhold, New York, 1990, p. 171.Google Scholar
2 Singer, P.H., Semiconductor International, 8 (June 1985), p. 67.Google Scholar
3 Zecber, R.F., Plastics Engineering, 8 (June 1985), p. 35.Google Scholar
4 Lu, Y.F., Chan, D.S.H. and Low, T. S., Pulse Laser Removal of Mold Flash on Integrated Circuit Packages, Patent being filed.Google Scholar
5 Iscoff, R., Semiconductor International, 8 (Dec. 1985), p. 38.Google Scholar
6 Seth, A. and Scaroni, J., Semiconductor International, 9 (Oct. 1986), p. 80.Google Scholar
7 Bergmann, H. W., Schutte, K., Schubert, E. and Emmel, A., Applied Surface Science, 86 (1995), p. 259.Google Scholar
8 Schutte, K. and Bergmann, H.W., Excimer Lasers, Kluwer Academic Publishers, London, 1993, P. 355.Google Scholar
9 Mil-std 883C, work method 2015, Feb. 1988.Google Scholar
10 Linn, J.H., Higley, M.M., Arruda, C.A., Walter, M.E. and Kosto, S., Semiconductor International, 18 (Apr. 1995), p. 79.Google Scholar
11 Gower, M.C., Laser Processing in Manufacturing, Chapman & Hall, London, 1993, p. 189.Google Scholar