Hostname: page-component-7dd5485656-gs9qr Total loading time: 0 Render date: 2025-10-30T05:13:35.549Z Has data issue: false hasContentIssue false
  • English
  • Français

Evolution of the Electrical Properties of Interconnects Under Electromigration Stress

Published online by Cambridge University Press:  10 February 2011

B.K. Jones ,
Jianping Guo ,
Yanzhong Xu  and
G. Trefan
B.K. Jones
Affiliation:
Department of Physics, Lancaster University, Lancaster, LA1 4YB, UK b.jones@lancaster.ac.uk
Jianping Guo
Affiliation:
Department of Physics, Lancaster University, Lancaster, LA1 4YB, UK b.jones@lancaster.ac.uk
Yanzhong Xu
Affiliation:
Department of Physics, Lancaster University, Lancaster, LA1 4YB, UK b.jones@lancaster.ac.uk
G. Trefan
Affiliation:
Department of Physics, Lancaster University, Lancaster, LA1 4YB, UK b.jones@lancaster.ac.uk
Get access

Abstract

We report experimental results of measurements of the changes in the resistance and thermal non-linearity of a variety of samples during accelerated electromigration stress to failure. The value of the extra measurement of the second harmonic of the AC bridge signal is illustrated by observations of changes in the thermal conductance to the substrate and the temperature coefficient of resistivity which are not detected by the resistance measurement. These quantities are also larger than the resistance measurement.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 516: Symposium E – Low Dielectric Constant Materials IV , January 1998 , 9
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1. Jones, B.K., “Microscopic measurements of electromigration damage using electrical measurements”, Mat. Res. Soc. Symp. Proc. 391, 489–500, 1995.10.1557/PROC-391-489Google Scholar
2. Jones, B.K. and Xu, Y.Z., “Measurement of the electrical properties of electromigration specimens”, Rev. Sci. Instrum. 66, 4676–80 (1995).10.1063/1.1145306Google Scholar
3. de Ceuninck, W.A., D'Haeger, V., Van Olmen, J., Witvrouw, A., Maex, K., De Schepper, L., De Pauw, P. and Pergoots, A., “The influence of addition elements on the early resistance changes observed during electromigration testing of Al metal lines”, Microelectron. Reliab. 38, 87–98 (1998).10.1016/S0026-2714(97)00064-4Google Scholar
4. Shih, W.C., Greer, A.L., Xu, Y.Z. and Jones, B.K., “Microstructure, damage and resistance during electromigration life-testing of Al-Cu interconnects”, Mater. Res. Soc. Symp. Proc. 309, 369, 1993.10.1557/PROC-309-369Google Scholar