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Estimation of Thermal Stresses and Stress Concentrations in Confined Interconnect Lines of Rectangular Cross Section

Published online by Cambridge University Press:  15 February 2011

M. A. Korhonen ,
P. Borgesen  and
Che-Yu Li
M. A. Korhonen
Affiliation:
Department of Materials Science and Engineering, Bard Hall Cornell University, Ithaca, NY 14853
P. Borgesen
Affiliation:
Department of Materials Science and Engineering, Bard Hall Cornell University, Ithaca, NY 14853
Che-Yu Li
Affiliation:
Department of Materials Science and Engineering, Bard Hall Cornell University, Ithaca, NY 14853
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Abstract

Stress-induced voiding is an important reliability concern in narrow aluminum based metallizations used as interconnects in very large scale integrated circuits. The thermal stresses that arise in the interconnects after excursions to elevated temperatures are tensile and extremely high. Void nucleation is commonly found to take place at the line edges where the stress is highest. In lines of rectangular cross section, in particular, there arise shear stresses at line edges and corners which can be higher than the dilational stress components. In this paper we consider analytically the stress states arising in interconnect lines of rectangular cross section. We argue that void nucleation is likely to be connected to the high shear stress at the edges and corners, facilitating grain boundary sliding.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 265: Symposium H – Materials Reliability in Microelectronics II , 1992 , 39
Copyright
Copyright © Materials Research Society 1992

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References

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