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Enhanced Adhesion of Copper Films to SiO2, PSG and BPSG by Refractory Metal Additions

Published online by Cambridge University Press:  25 February 2011

S.A. Rafalski ,
R.L. Spreitzer ,
S.W. Russell ,
T.L. Alford ,
J. Li ,
M. Moinpour ,
F. Moghadam  and
J.W. Mayer
S.A. Rafalski
Affiliation:
Arizona State University, Department of Chemical, Bio and Materials Engineering Tempe, AZ. 85287-6006 Intel Corporation, CH4-55, Chandler, AZ. 85226
R.L. Spreitzer
Affiliation:
Arizona State University, Department of Chemical, Bio and Materials Engineering Tempe, AZ. 85287-6006
S.W. Russell
Affiliation:
Arizona State University, Department of Chemical, Bio and Materials Engineering Tempe, AZ. 85287-6006
T.L. Alford
Affiliation:
Arizona State University, Department of Chemical, Bio and Materials Engineering Tempe, AZ. 85287-6006
J. Li
Affiliation:
Intel Corporation, California Technology and Manufacturing, Santa Clara, CA. 95052
M. Moinpour
Affiliation:
Intel Corporation, California Technology and Manufacturing, Santa Clara, CA. 95052
F. Moghadam
Affiliation:
Intel Corporation, California Technology and Manufacturing, Santa Clara, CA. 95052
J.W. Mayer
Affiliation:
Arizona State University, Center for Solid State Science, Tempe, AZ. 85287-6006
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Abstract

Copper films generally exhibit poor adhesion on dielectrics. It has been shown that the addition of refractory metals promotes adhesion via an interfacial reaction or better wetting to the dielectric. We investigate the adhesion of Cu-refractory metal (Cr, Ti) alloy films and bilayers on various silicon oxide substrates (SiO2, PSG, BPSG) after annealing in the temperature range 400-600°C by conventional furnace using N2/H2 forming gas. Rutherford backscattering spectrometry (RBS) was used to determine the interfacial reaction characteristics. The efficacy of a variation of the standard Scotch™ tape testing was evaluated. We found that the combined Scotch™ tape/scribe adhesion test revealed excellent qualitative bonding information and could be correlated well to RBS characterization. We were able to optimize the sample configurations and chemical compositions to achieve the best adhering film.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 337: Symposium B – Advanced Metallization for Devices and Circuits—Science, Technology and Manufacturing III , 1994 , 613
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

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