Hostname: page-component-745bb68f8f-g4j75 Total loading time: 0 Render date: 2025-02-10T12:09:50.312Z Has data issue: false hasContentIssue false
  • English
  • Français

Electromigration Failure and Mechanical Stress in thin Film Conductors

Published online by Cambridge University Press:  22 February 2011

J. R. Lloyd
J. R. Lloyd*
Affiliation:
Digital Equipment Corporation, 77 Reed Road, Hudson MA, U.S.A. and Max-Planck-Institut fur Metallforschung, Institut fur Werkstoff wissenschaft, Seestrasse 92, D-7000 Stuttgart, Germany.
Get access

Abstract

The role of mechanical stress in electromigration of thin films is reviewed and discussed. The role of stress in the driving force and the diffusivity are seen both to be important. The concept of the activation volume is discussed with regard to information available from its measurement. It is seen that void nucleation by electromigration or stress voiding is an unsolved theoretical problem.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 667
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1) Lloyd, J.R., Smith, P.M. and Prokop, G.S., Thin Solid Films, 93, 385 (1982)Google Scholar
2) Kemp, K.G., Poole, K.F., Frost, D.F., IEEE Trans. Reliab., 39, 26 (1990)Google Scholar
3) Shingubara, S., Iwabachi, S. and Shima, S., Proc. 19th Conference on Solid State Devices and Materials, 455 (1987)Google Scholar
4) Kwok, T., Chan, K.K., Chan, H., and Simko, J., J. Vac. Sci. Technol., A9, 2423 (1991)Google Scholar
5) Li, C.Y., Borgesen, P. and Sullivan, T.D., Appl. Phys. Lett. 59, 1464 (1991)Google Scholar
6) Baldini, G.L. and Scorzoni, A., IEEE Trans, on Electron. Dev., 38, 469(1991)Google Scholar
7) Kisselgof, Larisa, Elliott, L.J., Baranowski, S. and Lloyd, J.R., unpublished, paper in preparation (1991)Google Scholar
8) Blech, I.A., J. Appl. Phys, 47, 1203 (1976)Google Scholar
9) Blech, I.A. and Herring, Conyers, Appl. Phys. Lett., 29, 131 (1976)Google Scholar
10) Rosenberg, R. and Ohring, M., J. Appl. Phys., 42, 5671 (1971)Google Scholar
11) Kircheim, R. and Kaeber, U., J. Appl. Phys., 70, 172 (1991)Google Scholar
12) Martin, G., Blackburn, D.A., and Adda, Y., Phys. Stat. Solidi, 23, 223 (1967)Google Scholar
Peterson, N.L. in Grain Bounday Structure and Kinetics, ASM, Metals Park, Ohio (1979)Google Scholar
13) Lloyd, J.R. and Nakahara, S., Thin Solid Films, 72, 451 (1980)Google Scholar
14) Spitzer, S.M. and Schwartz, S., IEEE Trans. Electron Devices, ED-16, 348 (1969)Google Scholar
15) Learn, A.J., J. Appl. Phys., 44, 1251 (1973)Google Scholar
16) Lloyd, J.R. and Smith, P.M., J. Vac. Sci. Technol. ASI, 455 (1983)Google Scholar
17) Ainslee, N.G., d'heurle, F.M. and Wells, O.C., Appl. Phys. Lett., 20, 281 (1970)Google Scholar
18) Kahn, H. and Thompson, C.V., Appl. Phys. Lett., 59, 1308 (1991)CrossRefGoogle Scholar
19) Emrick, R.M., Phys. Rev., 171, 1720 (1961)Google Scholar
20) Heubner, R.P. and Homan, C.G., Phys. Rev., 129, 1162 (1963)CrossRefGoogle Scholar
21) Bass, J. and Lazarus, D., Physics Chem. Solids, 23, 1820 (1963)Google Scholar
22) Bourassa, R.R., Lazarus, D. and Blackburn, D.A., Phys. Rev., 165, 853 (1968)Google Scholar
23) Lloyd, J.R., Thin Solid Films, 91, 175 (1982)Google Scholar
24) Lloyd, J.R., Proc. 21st Ann. Int'l. Reliab. Phys. Symp. IEEE, 208 (1983)Google Scholar
25) Blech, I.A. and Tai, K.L., Appl. Phys. Lett, 30, 387 (1977)Google Scholar
26) Clement, J.J. and Lloyd, J.R., To Be Published, J. Appl. Phys, 15 Feb, 1992 Google Scholar
27) Nix, W.D. and Arzt, E., Met, Trans. (In Press)Google Scholar
28) Lloyd, J.R. and Nakahara, S., Thin Solid Films, 64, 163 (1979)Google Scholar
29) Borgesen, P., Korhonen, M.A., Basa, C., LaFontaine, W.R., Land, B. and Li, C.-Y., MRS Proc. Vol. 225, 143(1991)Google Scholar
30) Ross, C.A., MRS Proc. Vol. 225, 35, (1991) and references thereinGoogle Scholar
31) LaCombe, D.J. and Parks, E.L., Proc. 24th Ann. Int'l. Reliab. Phys. Symp. 1, (1986)Google Scholar
32) Yost, F.G., Amos, D.E. and Romig, A.D. Jr, Proc. 27th Ann. Int'l. Reliab. Phys. Symp. and references thereinGoogle Scholar