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Electric Current Induced Brittle Failure of Eutectic Lead and Lead-free Solder Joints with Electroless Ni-P Metallization

Published online by Cambridge University Press:  26 February 2011

Aditya Kumar ,
Zhong Chen ,
C. C. Wong ,
S. G. Mhaisalkar  and
Vaidhyanathan Kripesh
Aditya Kumar
Affiliation:
aditya@pmail.ntu.edu.sg, Nanyang Technological University, School of Materials Science and Engineering, N4.1-B3-02,, 50 Nanyang Avenue, Singapore, 639798, Singapore, +65 6316 8955, +65 6790 9081
Zhong Chen
Affiliation:
ASZChen@ntu.edu.sg, Nanyang Technological University, School of Materials Science and Engineering, 50 Nanyang Avenue, Singapore, 639798, Singapore
C. C. Wong
Affiliation:
WongCC@ntu.edu.sg, Nanyang Technological University, School of Materials Science and Engineering, 50 Nanyang Avenue, Singapore, 639798, Singapore
S. G. Mhaisalkar
Affiliation:
Subodh@ntu.edu.sg, Nanyang Technological University, School of Materials Science and Engineering, 50 Nanyang Avenue, Singapore, 639798, Singapore
Vaidhyanathan Kripesh
Affiliation:
kripesh@ime.a-star.edu.sg, Institute of Microelectronics, 11 Science Park Road, Singapore, 117685, Singapore
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Abstract

The mechanical properties of thermally-aged and electric current-stressed eutectic lead (Sn-37Pb) and lead-free (Sn-3.5Ag) solder joints with electroless Ni-P metallization were investigated using tensile testing. Multi-layered test samples, electroless Ni-P/solder/electroless Ni-P, having two electroless Ni-P/solder interfaces were prepared. Tensile testing results showed that for both types of solder, high density electric current causes the brittle failure of solder joint. The eutectic lead solder joint was found to be more prone to current induced brittle failure compared to the lead-free solder joint. In the eutectic lead solder joint, brittle failure always occurred at the cathode side electroless Ni-P/Sn-37Pb interface (where electrons flowed from Ni-P to solder), whereas no such polarity effect was observed in the case of lead-free solder joint.

Keywords

electromigrationpackagingstrength
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V05-06
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1. Lee, T. Y., Tu, K. N., and Frear, D. R, J. Appl. Phys. 90, 4502 (2001).Google Scholar
2. Chen, C. M. and Chen, S. W., J. Appl. Phys. 90, 1208 (2001).Google Scholar
3. Conrad, H., Mater. Sc. Eng. A 287, 227 (2000).Google Scholar
4. Kumar, A., Chen, Z., Mhaisalkar, S., Wong, C. C., Teo, P. S., and Kripesh, V., Thin Solid Films 504, 410 (2006).Google Scholar
5. Gan, H., and Tu, K. N., J. Appl. Phys. 97, 0635141 (2005).Google Scholar
6. Li, M., Lee, K. Y., Olsen, D. R., Chen, W. T., Tan, B. T. C., and Mhaisalkar, S., IEEE trans. Electron. Packag. 25, 185 (2002).Google Scholar