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Effects of Processing Conditions on the Material Properties of Polyimide Thin Films

Published online by Cambridge University Press:  25 February 2011

Doug Pietila ,
Lisa DeBra ,
John Guan  and
Chung Lee
Doug Pietila
Affiliation:
MCC Assigned Researchers, Boeing Aerospace and Electronics, Seattle, WA
Lisa DeBra
Affiliation:
MCC Assigned Researchers, Boeing Aerospace and Electronics, Seattle, WA
John Guan
Affiliation:
MCC, Packaging and Interconnect Program, Austin, TX
Chung Lee
Affiliation:
MCC, Packaging and Interconnect Program, Austin, TX
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Abstract

The effects of curing rate and solvent content prior to curing were examined for Hitachi PIX L110 polyimide thin films. DMA, TMA, DSC, and wafer bow measurements were used to elucidate in-plane storage modulus, Z-axis CTE, heat capacity, and residual stress dependencies on processing conditions and film position across the wafer. It was found that the residual stress and storage modulus are highly dependent on the processing conditions. Additionally, the heat capacity and storage modulus showed significant dependency on wafer position as well as processing conditions. The Z-axis CTE was found to deviate significantly from values published for the in-plane (xy) direction.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 289
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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