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Effect of Interfacial Characteristics of Metal Clad Polymeric Substrates on Electrical High Frequency Interconnection Performance

Published online by Cambridge University Press:  22 February 2011

K. B. Bhasin ,
R. R. Romanofsky ,
G. E. Ponchak  and
D. C. Liu
K. B. Bhasin
Affiliation:
National Aeronautics and Space Administration Lewis Research Center Cleveland, Ohio 44135
R. R. Romanofsky
Affiliation:
National Aeronautics and Space Administration Lewis Research Center Cleveland, Ohio 44135
G. E. Ponchak
Affiliation:
National Aeronautics and Space Administration Lewis Research Center Cleveland, Ohio 44135
D. C. Liu
Affiliation:
National Aeronautics and Space Administration Lewis Research Center Cleveland, Ohio 44135
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Abstract

Etched metallic conductor lines on metal clad polymeric substrates are used for electronic component interconnections. Significant signal losses are observed for microstrip conductor lines used for interconnecting high Frequency (above 20 GHz) devices. At these frequencies, the electronic signal travels closer to the metal-polymer interface due to the skin effect. Copper-teflon interfaces were characterized by SEM and AES to determine the interfacial properties. Data relating roughness of the copper film to signal losses was compared to theory. Films used to enhance adhesion, were also found, to a lesser extent, to contribute to these losses.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 40: Symposium J – Electronic Packaging Materials Science I , 1984 , 277
Copyright
Copyright © Materials Research Society 1985

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